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TI's PowerStackTM packaging technology in volume production

Von Texas Instruments Deutschland GmbH

Approach takes co-packaging to the next level with one-of-a-kind stacking method, enables 2D to 3D integration for power supply designers

Texas Instruments Incorporated (TI) (NYSE: TXN) has shipped more than 30 million units of its PowerStackTM packaging technology, which significantly boosts performance, lowers power and improves chip densities in power management devices. "Performance...
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Dallas, 27.07.2011 - Texas Instruments Incorporated (TI) (NYSE: TXN) has shipped more than 30 million units of its PowerStackTM packaging technology, which significantly boosts performance, lowers power and improves chip densities in power management devices.

"Performance requirements for computing applications are increasing in order to enable more content such as broadband mobile video and 4G communications," said Matt Romig, analog packaging at TI. "At the same time, there is a need for telecommunications and computing equipment to take up less space. Through a true revolution from 2D to 3D integration, PowerStack enables TI's customers to meet these demands."

PowerStack technology's benefits are achieved through an innovative packaging approach where TI's NexFETTM power MOSFETs are stacked on a grounded lead frame, using two copper clips to connect the input and output voltage pins. This unique combination of stacking and clip bonding results in a more integrated quad flat no-lead (QFN) solution.

By stacking the MOSFETs in the PowerStack approach, the clear benefit is a package reduction by as much as 50 percent over alternative solutions that position MOSFETs side-by-side. In addition to reducing board space, PowerStack packaging technology provides excellent thermal performance, higher current capability and higher efficiency for power management devices. For details on the benefits of PowerStack, visit ti.com/powerstack.

"PowerStack is the first packaging technology I've seen like this in the power arena," said Jan Vardaman, president and founder of TechSearch International. "Momentum for 3D packaging solutions is growing, and this technology is well suited to address a number of current and next generation design challenges."

PowerStack is in volume production today at TI's Clark facility.

"Clark is our newest, state-of-the-art assembly/test facility in the Philippines," said Bing Viera, managing director of TI Philippines. "This year, we are further expanding capacity for advanced packaging techniques in Clark, nearly doubling the site's initial capacity by the third quarter."

For more information on TI's manufacturing, visit www.ti.com/powerstack-pr-mfg.

Advancing analog through packaging leadership

PowerStack packaging technology is another example of TI's innovative approach to packaging that enables further advancements to applications that demand increased power density, reliability and performance at a lower cost. TI has the broadest packaging portfolio in the analog market, built upon decades of packaging expertise and supporting thousands of diversified products, packaging configurations and technologies. To learn more about TI's leadership in packaging, visit www.ti.com/powerstack-pr-pkg.

About TI's NexFET power MOSFET technology

TI's NexFET power MOSFET technology improves energy efficiency in high-power computing, networking, server systems and power supplies. These high-frequency, high-efficiency analog power MOSFETs gives system designers access to the most advanced DC/DC power conversion solutions available.

For more information on TI's NexFET(TM) Power Block visit: www.ti.com/powerblock-pr.

Trademarks

PowerStack and NexFET are trademarks of Texas Instruments Inc. All other registered trademarks and trademarks belong to their respective owners.

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