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The team will showcase the latest Qualcomm’s ICs as packaged modules, including the new FEM supported QCA6174A and the ultimate discrete USB channeled QCA9379, which offers a separate chain for Bluetooth 5.0+ connectivity. Packaged IC modules present clear benefits in ... | mehr
Die AIRETOS® E95 Klasse Serien H, X und G bauen auf dem Qualcomm Atheros Referenzdesign Peacock auf, das die Chipsätze der Serien AR958x und AR959x verwendet. Die Serien H, X und G verfügen über industrielle Versionen, die einwandfrei im Temperaturbereich von ca. -400bis ... | mehr
Since its introduction at CES2020, the AIRETOS® E63 Class has received significant demand for samples. The offering marries fully featured Wi-Fi 6 and Bluetooth 5.1 combo technology with a choice of form-factors, antenna types and operating grades; all widely certified in ... | mehr
The AIRETOS® E63 Class marries fully featured and certified Wi-Fi 6 and Bluetooth 5.1 with leading design techniques into a variety of module forms. With the QCA6391, QUALCOMM is building on its history of delivering game-changing technologies, like MU-MIMO 8-stream sounding. The QCA6391 is ... | mehr
May 28, 2019 | Taipei, Taiwan VoxMicro LTD, a California Corporation, today introduced the first Wi-Fi 6 Chip-On-Board (CoB) client modules, the AIRETOS® E63 Class, based on the newest Qualcomm® chipset, the QCA6390. The ground-breaking next generation of Wi-Fi and Bluetooth® connectivity protocols ... | mehr
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