Wir nutzen Cookies, um Ihren Besuch auf unserer Website und unseren Service zu optimieren.
Wir betrachten die weitere Nutzung unserer Website als Zustimmung zu der Verwendung von Cookies.
PortalDerWirtschaft.de



Suchmaschinenoptimierung mit PdW
mit Content-Marketing - Ihre News

Mission accomplished: TI's TMS320C66x multicore DSPs surpass industry standards on performance and floating-point capabilities, meeting vital requirements of power, accuracy and resolution for mission critical markets

Von Texas Instruments Deutschland GmbH

Raising the bar on performance and precision standards for mission critical applications, Texas Instruments Incorporated (TI) (NYSE: TXN) is offering developers the industry's highest performing multicore digital signal processors based on its TMS320C66x...

Milcom, Baltimore, 08.11.2011 - Raising the bar on performance and precision standards for mission critical applications, Texas Instruments Incorporated (TI) (NYSE: TXN) is offering developers the industry's highest performing multicore digital signal processors based on its TMS320C66x DSP generation. Ideal for applications such as software defined radios (SDRs), radar, surveillance and imaging cameras, TI's C66x DSP generation offers developers a variety of multicore solutions and capabilities, combined with an expanded array of IP cores and development software and tools, enabling sophisticated system architectures that are both power- and cost-efficient. With TI's C66x multicore DSPs, developers can more effectively meet the essential requirements of increasing processing power, accuracy and finer resolution in mission critical applications.

"The defense sensor processing market has an almost endless thirst for computational power often with the need for low power devices," said Bill Lundgren, CEO, Gedae, Inc. "The high bandwidth data on-chip data, available on-chip memory, flexibility of a MIMD multicore and massive available compute bandwidth make this family of multicore DSPs from TI very appealing for mission critical applications."

Meeting the needs of mission critical developers

Functionality, reliability and ease of use are vital factors mission critical developers must take into consideration when designing quality system applications. TI's C66x multicore DSPs deliver the industry's first 10-GHz DSP with fixed- and floating-point performance on a single device for increased precision, a key requirement for mission critical systems. Additionally, C66x multicore DSPs increase system capabilities by consolidating the functionality of multiple DSPs onto a single device, saving board space and cost and alleviating the challenge of size, weight and power (SwaP), as well as reducing overall clock rates and power consumptions. TI's multicore DSPs also address interface bandwidth requirements, such as SRIO, PCIe and Hyperlink. And for those applications required to work under extreme physical conditions, such as scorching temperatures and sustaining system long shelf life, TI's multicore solutions offer lead solder ball packages at industrial temperatures, making the C66x family highly reliable and useful in mission critical applications.

Meeting the needs of SDRs

TI's C66x DSP generation includes the TMS320C6670 radio SoC, a 1.2 GHz four core device, boasting improved accelerators for software defined radios (SDRs), public safety and emerging broadband radio systems. The C6670 includes a multistandard Bit Rate Coprocessor (BCP) as well as other coprocessors that accelerate physical layer processing for LTE, WCDMA, TD-SCDMA and WiMAX, substantially increasing system capacity and performance with low latency. In addition, the well balanced programmable CPU cores and configurable accelerators enable software defined radios with a simplified programming model. The addition of improved accelerators further helps to develop multistandard communications-centric solutions for the mission critical industry. In addition, TI's KeyStone multicore architecture allows developers to use the same platform, across TI's C66x multicore DSPs, for supporting multiple and complex waveforms in SDRs.

Meeting the needs of intelligent radar systems

Today's radar systems demand faster processing time for Fast-Fourier transform (FFT). TI's C66x multicore DSPs provide a path for parallel processing in order to meet the FFT processing time requirements. Radar developers can choose to use all of the cores or some of the cores to meet FFT time repose requirements. Once FFT performance is met within a radar system, developers can use the other C66x DSP cores to perform pre and/or post processing of the signals or other tasks in the system. In addition, TI's software tools provide full multicore entitlement to determine the best core configuration, allowing developers more flexibility to meet multiple requirements of radar systems.

Meeting the needs of surveillance and imaging systems

With the advent of cloud computing, there is a move for more centralized networks in surveillance applications, as well as a growing demand for advanced video analytics algorithms to assist in managing the increasing number of camera inputs. All of these demands require a significant amount of processing capabilities. TI's C66x multicore DSPs offer mission critical developers a large collection of algorithms from industry leading third parties and partners, as well as the ability to easily develop their own algorithms with TI's Vision Library. TI's Vision Library includes over 40 common kernels which serve as the essential building blocks of most video analytic algorithms. In addition, TI offers developers advanced codecs, including JPEG 2000, for the best possible image quality, low latency and no inter-frame dependencies which are necessary for many government regulated applications.

In addition to SDRs, radars and surveillance and imaging systems, TI's C66x multicore DSPs have ideal uses in application areas including, flight control, routing, servers, video processing networks and security.

Easing development with multicore software, tools and low cost EVMs

With its robust suite of multicore software, tools and low cost evaluation mo dules (EVMs), TI is easing development and getting customers closer to tapping the full performance of multicore. Significant updates to TI's multicore software kit and toolset, include Linux software, optimized libraries, support for the OpenMP programming model and a free multicore software development kit (MCSDK). Development and evaluation of the C66x multicore devices is made easy with comprehensive low cost EVMs available from TI. Designers can begin development on the C6678 multicore DSP with the TMDSEVM6678L for $399. The EVM includes a free MCSDK, Code Composer Studio(TM) integrated development environment (IDE) and suite of application/demo codes to allow programmers to quickly come up to speed on the new platform.

TI's KeyStone multicore architecture

Texas Instruments' KeyStone multicore architecture is the platform for true multicore innovation, offering developers a robust portfolio of high performance, low-power multicore devices. Unleashing breakthrough performance, the KeyStone architecture is the foundation upon which TI's new TMS320C66x DSP generation was developed. KeyStone differs from any other multicore architecture as it has the capacity to provide full processing capability to every core in a multicore device. KeyStone-based devices are optimized for high performance markets including wireless base stations, mission critical, test and automation, medical imaging and high performance computing. Learn more at www.ti.com/c66multicore.

TI's HiRel analog and embedded processing portfolio

In addition to commercial and industrial temperature offerings, TI's HiRel group is helping shape technology to improve the quality and accessibility of defense, avionic and aerospace applications, offering an enhanced product portfolio where high reliability and long service life are required. All of TI's analog and embedded processing products are available in industry-standard packages, which have the benefits of a controlled baseline, extended product change notification, extended temperature performance and qualification pedigree. TI guarantees all products will manufacture to datasheet specifications. For more information, please visit www.ti.com/ep.

For more information:

- Watch TI's multicore Ask The Experts series

- Engage with engineers and TI experts on the TI E2E(TM) Community and Multicore Mix

- Follow TI on Twitter

- Become a fan of TI on Facebook

08. Nov 2011

Bewerten Sie diesen Artikel

Noch nicht bewertet

Teilen Sie diesen Artikel

Keywords

Hinweis

Für den Inhalt der Pressemitteilung ist der Einsteller, PresseBox.de, verantwortlich.

Pressemitteilungstext: 1113 Wörter, 9050 Zeichen. Pressemitteilung reklamieren

Kommentar hinzufügen

Name*
E-Mail*
Institution
Website
Ihr Kommentar*

Weitere Pressemeldungen von Texas Instruments Deutschland GmbH


Texas Instruments DLP präsentiert bisher kleinstes und effizientestes HD Pico Chipset

DLP Pico 0.3"-HD TRP Chipset liefert hellere Bilder und eine längere Akkulebensdauer / Muster und optische Engines ab sofort über das branchenweit größte Ökosystem erhältlich

25.02.2014
25.02.2014: Barcelona, 25.02.2014 - Texas Instruments DLP hat auf dem diesjährigen Mobile World Congress (MWC) das weltweit vielfältigste und energieeffizienteste HD Mikrospiegel-Array der Welt vorgestellt. Das neue 0,3"-HD TRP Chipset ermöglicht 720p-Darstellungen für kompakte Geräte wie Tablets, Smartphones, Zubehör, tragbare Displays, Augmented Reality Displays, interaktive Oberflächen, digitale Zeichendarstellung und Steuerungspanel.Wie auch die anderen Neuzugänge der DLP-Pico-Familie nutzt das neue 0,3"-HD TRP Chipset die proprietäre Tilt & Roll Pixel-Architektur (TRP) und die adaptiven Inte... | Weiterlesen

Texas Instruments DLP beschleunigt Entwicklung im Bereich visueller Innovation

DLP Pico präsentiert auf der CES 2014 viele neue Produktkategorien / Zahlreiche Entwicklungspartner machen mit DLP ein breites Portfolio an neuen optischen Engines verfügbar

07.01.2014
07.01.2014: Las Vegas / München, 07.01.2014 - Texas Instruments (TI) DLP Products präsentiert auf der International Consumer Electronics Show (CES) über 30 neue Produkte und Applikationen, die durch die neue DLP Pico Chipset-Familie ermöglicht werden. Immer mehr Produkte, die bis vor Kurzem noch unvorstellbar waren, werden zur Realität. Dies zeigen die spektakulären Innovationen, die im TI Village (N115-N117) vorgestellt werden, darunter auch der erste batteriebetriebene Handprojektor, interaktive Projektionsdisplays, die nahezu jede beliebige Oberfläche in großformatige Touchscreens verwandeln.... | Weiterlesen

Texas Instruments bietet neues DLP LightCrafter 4500 Evaluierungsmodul, mit dem Entwickler von der Leistungsfähigkeit und Vielseitigkeit des Lichts profitieren

Neuestes Entwicklungskit ergänzt die gebrauchsfertigen Tools auf DLP-Basis für vielfältige aktuelle und zukünftige Applikationen

13.05.2013
13.05.2013: München, 13.05.2013 - Texas Instruments (TI) (NASDAQ: TXN) DLP Products stellt heute auf der Laser World of Photonics den DLP LightCrafter 4500 vor. Mit diesem jüngsten Angebot von TI DLP bekommen Entwickler alle notwendigen Werkzeuge an die Hand, um mit der preisgekrönten DLP-Technologie und der Leistungsfähigkeit des Lichts neue Produkte und Lösungen für die unterschiedlichsten Branchen zu entwickeln. Als Ergänzung zum ursprünglichen DLP LightCrafter - dem bislang erfolgreichsten Entwicklungskit von DLP - und in Verbindung mit den weiteren verfügbaren DLP-Komponenten verfügt der DL... | Weiterlesen