info@PortalDerWirtschaft.de | 02635/9224-11
Suchmaschinenoptimierung
mit Content-Marketing - Ihre News
COMPRION GmbH |

Testing if an eUICC Profile Works as Intended

Bewerten Sie hier diesen Artikel:
1 Bewertung (Durchschnitt: 4)


COMPRION releases test bench for new SIMalliance eUICC profile package test specification


COMPRION releases test bench for new SIMalliance eUICC profile package test specification

 

COMPRION offers a new test bench that contains all tests from the SIMalliance “eUICC Profile Package: Interoperable Format Test Specification, Version 2.1”. These tests check if the eUICC is able to interpret a profile in M2M and consumer devices environments correctly. Especially eUICC manufacturers and MNOs that use embedded UICCs have a strong interest that the cards support profiles according to the new SIMalliance specification. Interoperability and compliance of all involved components is the basis of successful eUICC ecosystems.

 

Andras Talas, Technical Consultant at COMPRION, and leader of the SIMalliance eUICC test subgroup responsible for the test specification, explains: “The test specification proves the card’s compliance to the SIMalliance “eUICC Profile Package: Interoperable Format Technical Specification”. The test cases prove the card’s capability to handle a profile correctly for example, by checking the successful creation of the file system or the loading and installation of an application. The test bench covers mainly nominal cases and a few error cases (the eUICC reports an error due to incorrectly specified profiles).

 

Hervé Pierre, SIMalliance Chairman, comments: “The availability of tools based onSIMalliance’s eUICC Profile Package Specification and the associated test specification, like this one from COMPRION, confirm the stability of this technology which will be integral to supporting the enablement of remote SIM provisioning in future consumer and M2M deployments across myriad sectors and use cases.”

 

The new SIMalliance eUICC Profile Package Test Bench is immediately available with COMPRION Connectivity Test Center R3.0. Integrated views for comprehensive monitoring and logging (RSP M2M View and RSP Consumer Devices View) allow displaying the testing steps and results in a very detailed way and thus help to analyze and resolve problems.


Für den Inhalt der Pressemitteilung ist der Einsteller, Kathleen Knievel (Tel.: 0525168590), verantwortlich.

Pressemitteilungstext: 291 Wörter, 2137 Zeichen. Pressemitteilung reklamieren

Unternehmensprofil: COMPRION GmbH

COMPRION is the worldwide leading manufacturer of test solutions for terminals and smart cards covering
contact-based and contactless technologies. Our standardization activities enable us to integrate the
latest standards into our products. As COMPRION systems are renowned for precise measurement capabilities, the company serves all top handset, card, chipset manufacturers, mobile network operators, and test houses.


Kommentare:

Es wurde noch kein Kommentar zu diesem Thema abgegeben.



Ihr Kommentar zum Thema





Weitere Pressemitteilungen von COMPRION GmbH lesen:

COMPRION GmbH | 03.05.2018

Validated COMPRION RSP Test Benches Support GSMA SGP.24 RSP Compliance Process

The newly published GSMA SGP.24 RSP Compliance Process V2.0 now requires functional testing by industry certification schemes GCF, PTCRB, and GlobalPlatform. These certifications schemes are referencing validated COMPRION RSP test benches for confo...
COMPRION GmbH | 16.04.2018

COMPRION EMVCo 4.3c Kontakt-Level-1-Tests von EMVCo qualifiziert

COMPRION hat heute verkündet, dass sie den „EMVCo Qualification Letter“ für die COMPRION IFM Protocol Level 1 Tests nach EMVCo Test Spezifikation 4.3c erhalten haben. Somit können sich EMVCo-akkreditierte Testlabore, die Produktzulassungen f...
COMPRION GmbH | 11.04.2018

COMPRION Launches New NFC Oscilloscope

  The SESAMES Award-winning software for design validation of NFC-enabled devices – Design Validation Center – has been extended by another unique feature: an NFC oscilloscope. It is immediately available with Design Validation Center R1.1. Th...